I'm trying to compile a table of alternative finishes, and would welcome
comments.
I've seen more discussion about this stuff here than on the Lead Free forum.

Finish: Tin
Applicablity: PWB's, Component Leads
Advantages: Inexpensive, Solderable
Disadvantages: Risk of tin whiskers

Finish: Silver
Applicablity: PWB's, Component Leads
Advantages: Solderable
Disadvantages: Shelf Life (tarnish), Environmental Issues

Finish: Palladium/Silver
Applicablity: Component Leads
Advantages: Proven History (TI)
Disadvantages: Expensive, Possible palladium embrittlement

Finish: ENIG
Applicablity: PWB's
Advantages: Flat, Solderable, Proven History
Disadvantages: Expensive, Black Pad, Possible gold embrittlement on small
solder joints

Finish: Gold Over Nickel
Applicablity: Component Leads
Advantages: Solderable, Proven History
Disadvantages: Expensive, Gold must be removed from SMT components before
soldering

Finish: OSP's
Applicablity: PWB's
Advantages: Inexpensive
Disadvantages: Limited shelf life, Limited reworkability for misprints

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------