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October 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Oct 2002 13:57:06 -0500
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The process is described in J-STD-033A

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Klawson
> Sent: Tuesday, October 29, 2002 11:21 AM
> To: [log in to unmask]
> Subject: [TN] Nitrogen drying?
>
>
> Hello Technet,
>
> A question came up this morning as to whether nitrogen could
> be used as a drying agent for PWBs, components, etc.  I know
> nitrogen is used as a fill gas for dry boxes, bags and to
> provide a dry atmosphere for component testing.  I don't have
> a feel for the physics of using nitrogen to dry something
> out.  We have a situation where baking at high temperatures
> may not be practical but immersion in a nitrogen atmosphere
> is.  Any ideas, references would be appreciated.
>
> Thanks,
> Gregg
>
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