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Subject:	Re: Dissolution Rate of Tin
From:	Dave Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 29 Oct 2002 12:05:57 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (66 lines)

Hi Ryan! Klein Wassink's book (ISBN# 0-901150-14-2) has a dissolution rate
table (table 4.19, page 114) for a number of elements (Sn, Au, Ag, Cu, Pd,
Ni, Pt) in 60/40 solder. The dissolution rates are temperature dependent -
what is your temperature of interest?

Dave Hillman
Rockwell Collins
[log in to unmask]





rgrant <[log in to unmask]>@ipc.org> on 10/29/2002 10:08:01 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
       to rgrant <[log in to unmask]>

Sent by:    TechNet <[log in to unmask]>


To:    [log in to unmask]
cc:

Subject:    [TN] Dissolution Rate of Tin


Hi Technetters,

I can't find my references for the dissolution rate of Tin into eutectic
Tin
Lead solder.  Anyone know?  And while we're at it, what is it for Nickel
and
Gold?

Thanks,
Ryan Grant
Supplier Quality Engineer
(208) 363-3683
[log in to unmask]

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