Gregg,

I would believe that a low, but elevated temp bake (50-90C) in vacuum would
be much more effective in removing moisture.  Moisture is polar and the
introduction of energy (in this case some heat and  vapor pressure) to break
that bond would be much more effective in driving it off.

Regards,
Bruce Misner

> ----------
> From:         Gregg Klawson[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Gregg Klawson
> Sent:         Tuesday, October 29, 2002 11:20 AM
> To:   [log in to unmask]
> Subject:      [TN] Nitrogen drying?
>
> Hello Technet,
>
> A question came up this morning as to whether nitrogen could be used as a
> drying agent for PWBs, components, etc.  I know nitrogen is used as a fill
> gas for dry boxes, bags and to provide a dry atmosphere for component
> testing.  I don't have a feel for the physics of using nitrogen to dry
> something out.  We have a situation where baking at high temperatures may
> not be practical but immersion in a nitrogen atmosphere is.  Any ideas,
> references would be appreciated.
>
> Thanks,
> Gregg
>
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