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October 2002

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 27 Oct 2002 12:32:33 -0600
Content-Type:
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Please don't shoot the messenger; just sharing industry consensus criteria. Steve, if your agreement is to accept to IPC-A-610 you need to consider the following and develop exception agreement with your customer if appropriate. As can be seen, the requirement to solder press-fit pins isn't new.

Based on the number of "you shouldn't" replies to Steve's posting, I find it unusal that I can't find any record of comment submitted to this criteria in the past seven years. 610 revision efforts are underway. Further, I don't remember discussion on this criteria at any of the approx. 40 Rev C development committee meetings. Now is the time for someone to step forth with some failure substantiation because of soldering or the committee likely won't consider changing the soldering requirement. Anyone with support of why it's necessary to solder would also be welcome to revalidate the existing requirement.

Criteria in IPC-A-610B pub Dec 94 and currently in Rev C pub Jan 2000:

6.9 Connector Pins - Press Fit Pins

Target - Class 1,2,3
* A 360° solder fillet is evident on the secondary side of the
assembly.
Note: Solder fillet or fill on primary side is not required.

Acceptable - Class 1,2
* Solder fillet or coverage (secondary side) is present on two
adjacent sides of the pin.

Defect - Class 1,2
* Less than two adjacent sides with solder fillet.
* Less than two sides soldered.
Defect - Class 3
* Less than four sides of pin contain solder.

Acceptable - Class 1
* Solder wicking is permitted above 2.5 mm [0.0984 in] on
sides of pins provided there is no solder build up which
interferes with subsequent attachments to the pin.
Acceptable - Class 2,3
* Solder wicking on sides of pins is less than 2.5 mm [0.0984
in], provided the solder does not interfere with subsequent
attachments to the pin.
Defect - Class 1,2,3
* Solder build up interferes with subsequent attachments to
the pin.
Defect - Class 2,3
* Solder wicking exceeds 2.5 mm [0.0984 in].

Comments need to be in the following format:
Name/company/phone & email so committee leaders can contact you for more info.
Paragraph/figure number being commented against:
Your recommendation:

Reason for requesting the change (substantiation):


Thanks to all for support of TechNet and the peer-consensus standards development process.

Cordially
Jack

Jack Crawford
Director, Professional Development and Assembly Technology
[log in to unmask]
847-790-5393
fax 847-504-2393

APEX 2003 March 31-April 2 Anaheim CA
www.goapex.org
IPC Printed Circuits EXPO March 25-27 Long Beach CA
http://www.ipcprintedcircuitexpo.org/

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