Hi Rick! We are currently able to clean under a 3-4 mil component standoff
using an in-line cleaner with Kyzen/Water chemistry (we used Ion
Chromatography testing to verify our cleaning effectiveness). BUT as Brian
E. pointed out, there are a number of process variables which need to be
carefully investigated and researched. We conducted a number of DOE's and
found the following variables all contribute to your ability to clean under
small spaces: cleaning chemistry, chemistry temperature, nozzle design,
nozzle angle, nozzle pressure, assembly component density, and assembly
orientation. Also, one factor which can play a huge role is the type of
basket used to carry an assembly through the cleaning equipment. The basket
design can totally erase the effectiveness of understanding/setting other
process variables. Good Luck.

Dave Hillman
Rockwell Collins
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Rick Thompson <[log in to unmask]>@ipc.org> on 10/24/2002 05:57:00 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
       to Rick Thompson <[log in to unmask]>

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Subject:    [TN] Water-soluble flux wash pressures?


Hi,

We've been having a discussion regarding the wash pressures needed to
adequately clean under low profile components while not exceeding pressures
that are recommended by some surface mount switch and relay vendors.  I'm
curious as to what range of pressures are generally being used to clean
water-soluble fluxes?  I realize that some of this is a function of
component height, density, etc. but would be interested in data that anyone
would care to share.

As a related item, does anyone know of any published material detailing
what
are minimum clearances that parts need to overcome water surface tension
(with or without surfactants) allowing them to be cleaned under?


Thanks in advance.

Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
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