IPC-Association Connecting Electronics Industries and JEDEC-the Solid State Technology Association are sponsoring an International Conference on Lead-Free Electronic Components and Assemblies from December 9-12 2002 at the Grand Hyatt Taipei, Taipei Taiwan, No. 2 Sung Shou Road, Taipei, Taiwan.

Martin Freedman, Molex, and David Bergman, IPC, are the Conference Chairs. 

CLICK HERE TO DOWNLOAD THE BROCHURE AND REGISTRATION FORM:  http://www.ipc.org/LF/LeadFreeConference.htm 

The European Union marches closer to establishing a firm date for lead elimination in most electronics. Public and political pressure against lead continues to grow, especially outside the US. Japan, Denmark and the European Union (EU) are all proposing bans on lead and products containing lead. International OEMs are becoming more sensitive to the issue and continue to press their suppliers to develop plans. 

A ban in Europe will have an effect in the global marketplace, which will force many manufacturers to eliminate lead as effectively as a their own country ban. Data is now coming in from individual companies' and consortia efforts. 

Many challenges still exist and the path forward to success is not one of consensus. Companies need to stay aware of the hot issues remaining in order to focus efforts that will allow success to be achieved by 2006-2007.

Visit the tabletop exhibits at this year's conference! Many of the industry's top suppliers will be showcasing their products and services during the conference breaks, lunches and reception. Admittance to the exhibits is included in any conference registration. 

If you are interested in exhibiting, contact Nilda Mendez at 847-790-5329 or by email at: [log in to unmask] for a tabletop exhibit application.

Hotel Information 
Both the workshops and conference will be held at the Grand Hyatt Taipei, Taipei Taiwan, No. 2 Sung Shou Road, Taipei, Taiwan. Rooms are available at the hotel for a special IPC/JEDEC room rate of NT$5,330+ single (approximately $152 US), NT$5,830+ double (approximately $166 US) per night. For reservations, please contact the hotel at 886-2-2720-1200. Rooms and rate are subject to availability after November 16, 2002, so please make your reservations early.

CONFERENCE INFORMATION (Professional Development Course Descriptions are below)

International Conference On Lead-Free Electronic Components and Assemblies
Wednesday/Thursday December 10/11, 2002

Challenges in Adopting Pb-free Interconnects for "Green" Electronics
Dr. Michael Pecht 
CALCE Electronic Products and System Center 
University of Maryland-College Park, MD, USA

Lead free Technical Issues
K.F. Wong
Redring Solder (M) Sdnbhd
Selangor, Malaysia

Lead-free Soldering Technology 
Anita Choo Henkel ( Malaysia ) 
Sdn Bhd-Perak
Malaysia

Lead-Free Matte Sn Termination for Lead Frame Packages 
Achut Kumar
Intel Corporation
Chandler, AZ, USA 

Electroplating of Lead-free Tin Alloys 
Dr. Manfred Jordan
Dr. Ing. Max Schlötter
GmbH & Co. KG
Geislingen/Steige Germany

Qualification of Pure Matte Tin as an Alternative for Tin Lead 
Arlene V. Layson
NS Electronics Bangkok
Bangkok Thailand

Metallurgy and Stability of the Pure Sn/Ni and Sn/Cu Interface for Lead-free Flip Chip Application 
Professor Raymund W.M. Kwok
The Chinese University of Hong Kong
Hong Kong

Lead-Free Plating on Integrated Circuit 
Anocha Sriyarunya
AMD(Thailand) Ltd.- Pakkred
Nonthaburi Thailand

Whisker Formation Study of Lead-free Plated Packages 
Jeffrey Lee
Advanced Semiconductor Engineering, Inc.
Kaohsiung, Taiwan, R.O.C.

Tin Whiskers: Their Appearance, and Reduction in Electronic Connectors
Dr. Sudarshan Lal, FCI
Etters, PA, USA 

Whisker Free Solution
Dr Helmut Bruckner
UNICRON GmbH 
Kirchheimbolanden, Germany

Whisker Growth: The Substrate Effect and Beyond
Yun Zhang 
Technic Plainview, 
NY USA 

Lead free Motherboard Assembly at Intel-Lessons Learned
Dr. Tao Liu
Intel
Hillsboro, OR, USA

Lead-free Package Reliability 
Jeffrey Lee
Advanced Semiconductor Engineering, Inc
Kaohsiung, Taiwan, R.O.C.

Reliability Evaluation for Lead-free Packages
Dr. Tammy Tzan
Industrial Technology Research Institute
Hsinchu, Taiwan, ROC

EPA/Industry Design for the Environment Program
David Bergman
IPC

JEDEC's Lead-Free Position
Marty Freedman
Molex

IPC's Lead free Position & Status of Lead Free in the U.S.
David Bergman
IPC


EDUCATION COURSES

T-01 (Full Day Course)
Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive Adhesive Materials
John H. Lau, Agilent Technologies, Inc.
December 9, 2002  8:30 am-4:30 pm

This course gives you fundamental principles, engineering data and cutting edge information on the most important developments and latest research results to help you apply the lead-free, halogen-free, and conductive-adhesives technologies. For professionals involved in high-density interconnections that demand a cost effective design and high-yield environmentally benign manufacturing processes, this course is a timely summary of progress in all aspects.

Topics to be Covered
* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with microball mounting and paste printing methods
* Lead-Free solder joint reliability of WLCPs
* Chip (wafer) level interconnects with solderless bumps
* Design, materials, process, and reliability of WLCSPs with solderless interconnects
* Halogen-free molding compounds
* Environmental issues for conventional PCBs and substrates
* Emerging technologies for fabrication environmental friendly PCBs
* Lead-free legislation and consortia programs

-------------------------------------------------
W:01: 
Lead-Free Interconnections-Technology, Selection and Applications
Jennie Hwang, Ph.D., H-Technologies Group, Inc.
December 9, 2002  8:30 am-4:30 pm

Environmental and health concerns have brought about government regulation restricting lead usage. In addition, the evolution of advanced IC packages (BGA, CSP, Flip Chip) demand a higher level of performance of solder joints. Both performance demands and environmental mandates prompt the need for more knowledge about lead-free solders. This course will provide a clear understanding of lead-free solders from application perspectives and present selection criteria for lead-free compositions.

Topics to be Covered 
* General introduction of lead and resources
* Legislation status: US, Japan, Europe
* New compositions vs. known binary Sn-Cu, Sn-Bi, Sn-Ag, Sn-Sb, Sn-Zn, and Sn-In systems
* Pros and cons of various lead-free alloy systems
* Lead-free surface coatings on PCBs and components
* Lead-free solder balls and solder bumping for BGA, CSP, and flip chip
* Differentiation of solder joint failure modes between Sn/Pb and lead-free
* Manufacturing factors: cost vs. performance
* Selection criteria of various lead-free systems and compositions
* Strengthened characteristics of lead-free alloys
* Recommendations to manufacturers 

-------------------------------------------------
W-02: Lead-Free PCB Surface Finish & Component Coating
Jennie Hwang, Ph.D., H-Technologies Group
December 9, 2002  1:30 pm - 4:30 pm 

The properties and performance of PCB surface finishes and the component lead coating/terminations are important to the PCB assembly's long-term integrity as well as to the SMT production yield. This course will provide attendees a proper level of understanding of the important factors that determine the solderability and performance of Lead Free surface finishes and component coatings from both chemical and metallurgical aspects. The material and process options will be reviewed, and the pros and cons of various material/process systems from manufacturing perspectives will be discussed.

Topics to be Covered
*Solderability-principle & definition
*Solderability factors-substrate, chemistry, metallurgy, manufacturing process
*PCB surface finish-major functions
*PCB surface finish- materials and processes
*Performance of various lead-free metallic systems vs. organic coating vs. HASL 
*Relative performance of lead-free surface finishes with lead-free solder joints
*Black pad issue
*Tin whisker-phenomena, factors
*The role of gold, palladium, intermetallics in solderability and solder joints
*Component lead coating/terminations-types
*Lead-free component lead coating/terminations vs. Sn/Pb coated leads
*Recommendations


CLICK HERE TO DOWNLOAD THE BROCHURE AND REGISTRATION FORM:  http://www.ipc.org/LF/LeadFreeConference.htm 

All workshop attendees will receive course material, refreshments, and lunch. All conference registrants will receive conference proceedings, continental breakfast, and lunch on both days and admission to the tabletop exhibits and the December 10th reception. Please register by November 15, 2002. For more information or if the registration deadline has passed, please contact Nancy Feaster at 847-790-5313.

Cancellation Policy: Cancellation received before December 6, 2002 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If events are cancelled, participants will receive a full refund. Substitutions are acceptable.
Download Registration Form in pdf format. Please print out form and fax or mail.

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