Re high pressures- solder joints will take more abuse than people often give
them credit for... some unpublished work that one can go over 1,000 psi to
the point you can remove all the rosin flux residues from a board using pure
water with no effect on solder joints.

Published work by D. Lermond on CFC-113 pressures in this range vs solvent
volume, found that best cleaning done with high pressure/high volume. Look
back in your 1986 or thereabouts IEPS Proceedings. You also might want to
look into the work done by Connon and Wolff as well. As I recall there was a
study vs clearance in that paper. Also Bob Musselmann at Quadrex did some
really nice work on very high pressure cleaning as a result of studies done
on decontamination of tools used in the nuclear power industry. While all
these studies were done using CFC-113 formulations, the high pressures do
give you a starting point range for testing. The unknown here is removal of
the WSF that has been imbibed by the solder mask and/or laminate surface,
esp. if the Tg of these are low and the boards are really heated during the
soldering operation.

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