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October 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Oct 2002 15:30:21 -0400
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A small ball mill for board repair will work. Chip bonding adhesive will
work to hold it in place through multiple reflow cycles.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tobias.Chang
> Sent: Tuesday, October 22, 2002 3:36 PM
> To: [log in to unmask]
> Subject: [TN] drilling hole for thermo-profile
>
>
> can anyone suggest methods for drilling small holes in PCBs
> to facilitate temperature profiling (putting thermocouples
> from under the board to the surface - under a BGA)
>
> and while i'm at it, can anyone recommend a specific epoxy or
> adhesive that can be easily applied to fill up the (small
> hole), that can handle the high temperatures, and hold the
> thermocouple in place?
>
> (i'm told this is the best practice to get accurate
> temperature profiles for BGA's - for a rework station, if
> there are better methods out there i'd be glad to hear about
> those too) =)
>
> thanks,
>
> toby
>
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