Steve,
From what I have read everyone is right in their statements.
So may I add just a little more confusion or fire( I'm not sure yet) to the pot.
If I am correct your question is.
Do you have to have the front end and sides of the component lead of a flat ribbon, L , or Gull Wing soldered?
My answer is NO.
What you do have to have is
1) Acceptable alignment of the part per your class 1,2, or 3 AS: side overhang, and toe overhang.
2) Acceptable fillet height per your class 1,2, or 3
3) Acceptable side joint length per your class 1, 2, or 3.
Please note that in no area of IPC 610 C ( that I know of) does it say to cover the toe or sides of the lead.
I believe the important issue here is that the contact portion of the lead to the pad is sufficiently covered with solder. If you have these items covered above I would pass the parts. The soldering process will dictate the amount of solder you are able to get on the toe and sides of exposed copper. You should get a variety of fillet height now. But most of them I believe will be very minimum
Besides , reworking solder joints that are in an acceptable condition is not advisable.
Nancy T.
>>> [log in to unmask] 10/24/02 10:06AM >>>
Hi All!
I've got a situation here with a SMT socket. It's a SAMTEC CLT-105-02-L-D.
The leads are made from stamped pre-plated stock, so the sides and toes of
the leads have exposed copper, and of course doesn't wet during reflow.
In J-STD-001B, it used to say under 9.2.6.1 Flat, Ribbon, "L" and Gull Wing
Leads:
"Leads not having wettable sides or ends by design (such as leads stamped or
sheared from pre-plated stock) are not required to have side or end fillets.
In J-STD-001C it has no mention of that under the same section, in J-STD-001C
the section number has changed, it's 9.2.6.8.
So if you have leads that are made from pre-plated stock and have the sides
and toes not wet because of the exposed copper, is it now a defect? If it is,
how in the heck are you going to get the sides and toes to wet?
Thanks!
-Steve Gregory-
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