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October 2002

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 23 Oct 2002 13:14:43 -0500
Content-Type:
text/plain
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text/plain (61 lines)
Yes, your fabricator should have baked it after wet processing...you should
bake it before soldering, your mother should bake it along side those
delicious apple pies...polymide is a friggin sponge...bake bake bake...

Don't worry, the scent and/or aroma of cinnamon and apples will in no way
affect the electrical properties of the board...seriously...

Franklin
----- Original Message -----
From: "Graham Collins" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, October 23, 2002 1:06 PM
Subject: [TN] board bake?


Good day Technet!
Another PWB question for the 'net today.

If you have a board made with Polyimide material ( IPC 4101/40) would you
bake it prior to processing?  We gave up baking FR-4 boards years ago with
no impact, but there is some debate as to Polyimide.

Please note, I'm not talking about flex prints, I understand they need to be
baked before processing due to delamination issues.

Thanks!


regards,

Graham Collins
Process Engineer,
Northrop Grumman Canada Corporation
Halifax
(902) 873-2000 ext 6215

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