Good day Technet!
Another PWB question for the 'net today.  

If you have a board made with Polyimide material ( IPC 4101/40) would you bake it prior to processing?  We gave up baking FR-4 boards years ago with no impact, but there is some debate as to Polyimide.

Please note, I'm not talking about flex prints, I understand they need to be baked before processing due to delamination issues.

Thanks!


regards,

Graham Collins
Process Engineer, 
Northrop Grumman Canada Corporation
Halifax
(902) 873-2000 ext 6215

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------