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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Tue, 22 Oct 2002 14:50:41 -0400 |
| Content-Type: | text/plain |
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Bill,
We experienced a similar situation. We hammered our vendors for price, price, price. So one vendor used the older (and cheaper) system of SR2000 over reflow. Worked fine until we wave soldered boards. We are smarter now (we moved into the mid 20th century... we still do thru-hole with no SMT) and all our boards are wave soldered (where ever possible) and ail are SMOBC.
What was on your print for method of construction?
Phil
-----Original Message-----
From: Brooks,Bill [mailto:[log in to unmask]]
Sent: Tuesday, October 22, 2002 2:30 PM
To: [log in to unmask]
Subject: [TN] Solder UNDER Soldermask Accept/Reject Criteria?
Anyone aware of a spec that sets the accept/reject criteria for boards that
come in with solder UNDER the soldermask? Is this actually done as a
legitimate practice? WHY would a vendor make the boards this way? Shouldn't
we be making all boards to be SMOBC when there is a soldermask?
Bill Brooks
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