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October 2002

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Oct 2002 10:25:28 -0500
Content-Type:
text/plain
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text/plain (61 lines)
IPC TM-650-2.4.28 (also 2.4.28.1b) may be used to test/verify adhesion of
solder mask.


----- Original Message -----
From: "Juan T. Marugán" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, October 18, 2002 10:07 AM
Subject: [TN] Poor solder resist adherence.


Good afternoon from Spain,

We have detected a problem in a type of class 3, double side, PCB's
(military). Chip components were bonding with adhesive to the board before
wave soldering and we had to remove one of them. We were wondering because
solder resist was also detached with the component. We repeated this
operation in another board with similar results. It's the first time we
observed this concern.

Could you tell me which is the acceptance criteria? I only have found it in
section 9 of A-610C. Is there a test method to verify the correct adherence
of solder mask?

Thank you to all technetters!


Juan T. Marugán López
Production Quality Assurance

INDRA EWS, Sociedad Anónima
C/ Joaquín Rodrigo 11
28300 Aranjuez - Madrid (SPAIN)
[log in to unmask]
www.indra.es

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