TECHNET Archives

October 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Willie Duersch <[log in to unmask]>
Reply To:
Date:
Wed, 2 Oct 2002 08:09:03 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
What was your PCB plated plating finish, and the paste type?

Willie Duersch
Projects Manager, Technical Sales
Inovar, Inc.
1073 West 1700 North
Logan, UT 84321
Phone: 435-792-4949 x105
Fax: 435-792-4950
Cell: 435-881-2219 (best)
E-mail: [log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Eric Castonguay
Sent:   Tuesday, October 01, 2002 4:05 PM
To:     [log in to unmask]
Subject:        [TN] Dual footprint on Stacked Memories

Technet,
we are using a very special component on our pcb designs that has dual
footprint (fine pitch and BGA arrays). This component is made of two TSOP66
stacked in tower and have mixed terminals: gull wing leads and BGA balls.
So, both TSOP are assembled together with an interposer PCB in order to
make a stack. Bottom TSOP is weld to motherboard and high-temperature
solder (lead-free paste) is used to weld TSOP leads to the interposer pcb.
BGA solder balls are SN96/AG4 and also interfaced with motherboard.

First, is anybody out there ever used this type of lead-free package
before? Any success?

We had many issues so far at our CM with these stacked memories: open
contacts (microfractures, missing solder, poor wettability) and misaligned
components. We think it is mainly because non-eutectic balls doesn't reflow
with standard temperature profile (60 sec. at 183 deg. C with peak at 220
deg. C). Hence creating poor joints.

Regards,

Eric Castonguay
Hyperchip

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2