Hello,
Maybe this question is not typical Technet-related, but I think I can find
some solder-expertise on this forum.

By quickly dipping a copperwire of 0.6 mm in a HighMeltingPoint-solderbath
(MP=296 -302°C), we succeed to take up 5 to 15 mgr (±1 mm(superscript: 3))
solder at 5 mm from the end of the wire (our target is 10 mgr). Because
this is a non-equilibrium process the spread is rather high. Nevertheless
we try to improve the reproducability. Important factors which we can
control are:  temperature and  withdrawal speed . Surface tension
(influenced by the flux) and viscosity of the solder must be important too
but difficult to measure and to influence.
I can use any ideas / considerations / information how we can improve the
reproducability.

some other related questions:
-how long works the addition of 100 ppm Phosphor in the solder ?
-which could be the influence of eutectic solder (Pb(subscript: 97.5)Sn
(subscript: 1)Ag(subscript: 1.5)  MP=309°C) versus paste range solder (HMP
Pb(subscript: 93.5)Sn(subscript: 5)Ag(subscript: 1.5)  MP=296-302°C) on the
solidifying and reproducability on the wire?
-we use flux to dip the wire and a scraper to evacuate the dross (lot of
dross!) on the solderbath-surface, we do not know a soldercover(oil) except
the too agressive ammonium-zinc-chlorides; are there alternatives? Bath is
operating at 340°C.
-are there alternative droplet depositioin techniques: what about droplet
deposition by jetting? Feasable?

Thanks in advance,
Jos
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