Does anyone have experience using TBGAs? I understand that a thermal bond is
made between the lands on a ceramic chip
and a Copper laminate tape to which is added solder balls on the bottom of
the tape to make bond to PWBs. This is supposed to solve the CTE difference
problem. What is the nature of the chip bond to tape and how and why does it
survive CTE differences?
Does anyone out there have thermal cycling data on them and assembly
experience with them?

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