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October 2002

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Subject:
From:
Steve Mac Donald <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Oct 2002 14:59:30 -0500
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Good Day to everyone,

We have been experiencing an issue with deep gold plating after etch.  The
undercut is breaking away making the traces look "hairy."  The gold either
clings and drags away from the trace or breaks loose at LPI/Soldermask and
floats in the ink to some other undesireable location. It is not consistent
but it is persistant.  Has anyone had this issue before and could someone
suggest some possible solutions? (It never happens with standard copper
plating--just deep gold.)

Thanks,

Steve MacDonald
Mass Design

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