With respect to component changes only, we've had a few parts converted
to no-lead (Sn/Bi and Sn/Bi/Cu) finishes and seen no difference in solderability
with our normal profiles. We didn't see the need to change anything.
-----Original Message-----
From: Dave Hornback [mailto:[log in to unmask]]
Sent: Thursday, October 10, 2002 8:13 AM
To: [log in to unmask]
Subject: [TN] Roadmap for Transition to Lead Free Components?
Does anyone have a good source for learning more about how SMT components
will transition to "lead free"? How are you planning this at your
facility? I'm particularly interested in how this will effect reflow
profiles when both "lead free" and traditional components are mixed on a
board. We have some modular IC's with internal solder connections as well.
Thanks in advance for any info. Dave
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