Hi Dave,

The reflow profile will not be affected with the addition of lead-free
components.  As a matter of fact, you may already be using some lead-free
components.  When you think about it, unless your board is HASL coated, it
is lead-free (ie OSP, Gold, immersion Tin, immersion Silver) and it solders
just fine with a normal reflow profile.  The reflow profile will only need
to be changed when you begin using a lead-free SOLDER as its liquid
temperature is higher the leaded solder.

Ryan Grant

-----Original Message-----
From: Dave Hornback [mailto:[log in to unmask]]
Sent: Thursday, October 10, 2002 9:13 AM
To: [log in to unmask]
Subject: [TN] Roadmap for Transition to Lead Free Components?


Does anyone have a good source for learning more about how SMT components
will transition to "lead free"?  How are you planning this at your
facility?  I'm particularly interested in how this will effect reflow
profiles when both "lead free" and traditional components are mixed on a
board.  We have some modular IC's with internal solder connections as well.

Thanks in advance for any info.   Dave

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