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Subject:	Re: Copper distribution
From:	[log in to unmask]
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 9 Oct 2002 20:43:50 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Rudy,
That was an excellent description.  Thanks.  Plating thickness distribution
does not have to be so bad.  If you go to www.smartcatshield.com you will
find technical papers that can be downloaded that aptly describe the problem
and offer a solution.  One of the papers was delivered to the IPC in April of
2001.  Another was published in The Board Authority.

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