Hi Roland,
>What about some consideration for the HAL or solder prep. ? It is known to
>etch" away some of the copper.. thus reducing eventually the thickness of
>the barrel at its weakest places ?
Actually the solder 'etches' copper away most at the shoulder/knee, which is
not the weakest area of the PTV barrel. Significant dissolution of Cu into
the solder occurs to ant significant extent only in out-of-control processes.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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