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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 28 Oct 2002 09:33:25 -0500 |
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[log in to unmask] wrote:
>
> snipped for brevity <
>
> Press fits were/are used primarily to permit wire wrapping of backplanes.
Peter, I'll agree with "were", but for "are" I must dis-
agree with you. (That's a first!)
I see pressfit in all manner of high performance elec-
tronics, from CPCI and VME-64X through to mega-bandwidth
network gear. I believe it is popular in the complex
spectrum because it spares a thermal excursion and is
reworkable, both important on these .250" thick 20+ layer
beasts, and as a non-soldered connection can be made in
finer pitches. 2mm pitch is more than common and many
more dense arrangements are showing up all the time.
So from context you'll all know that I fall on the side
of non-soldering, and take the -610 comment to regard
single staked pins also.
Meanwhile I've a new(ish) problem with pressfit. Due to
the hole size and construction contstraints, a number of
fab shops want to move away from HASL to IAg or ISn for
the surface finish. I am suspicious both of the amount
of insertion lubrication available in these finishes and
also the long-term life when these are not dispersed in
a soldering step. Any commentary out there on this?
Thanks and regards,
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
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