Dan, it's my impression that gold on leads is more likely to be
electroplated than immersion.  Does anyone know?

Thanks to all for your suggestions.  No surprise that there
were a lot more responses about PWB's than component finishes,
given the makeup of this group.  Still, it seems like there
are many more interesting things to see on the PWB side of the
alternative finishes zoo.

Joe Kane
BAE SYSTEMS Controls
Johnson City, NY


-----Original Message-----
From: Dan R. Johnson [mailto:[log in to unmask]]
Sent: Thursday, October 03, 2002 12:30 PM
To: [log in to unmask]
Subject: Re: [TN] Alternative Finishes To Tin/Lead


Hi Kane,
I have a similar table in my design note book.
A couple of things;
-I have as a disadvantage for OSP's a limited number of heat excursions ,
thanks to Technet for that bit of information.
-I also have it from Technet that OSP's can be re-coated thus extending the
shelf life.

BTW what is the difference between ENIG (electrolysis nickel, immersion
gold) and gold over nickel?

I assume these are alternatives to SMOBC/HASL (solder mask over bare
copper/hot air solder level). Since we don't do any fine pitch components
this is the finish of choice around here. I know this is not offered as lead
free right now but have high hopes that some PCB vendors will see an
opportunity. I'm pretty sure there are other folks out there that supply the
CE and Japan, markets that are asking for lead free assemblies, and would
like to buy lead free HASL PCB's.

Good luck finishing ;-) your table,
Dan

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