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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 29 Oct 2002 12:05:57 -0600 |
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Hi Ryan! Klein Wassink's book (ISBN# 0-901150-14-2) has a dissolution rate
table (table 4.19, page 114) for a number of elements (Sn, Au, Ag, Cu, Pd,
Ni, Pt) in 60/40 solder. The dissolution rates are temperature dependent -
what is your temperature of interest?
Dave Hillman
Rockwell Collins
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rgrant <[log in to unmask]>@ipc.org> on 10/29/2002 10:08:01 AM
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Subject: [TN] Dissolution Rate of Tin
Hi Technetters,
I can't find my references for the dissolution rate of Tin into eutectic
Tin
Lead solder. Anyone know? And while we're at it, what is it for Nickel
and
Gold?
Thanks,
Ryan Grant
Supplier Quality Engineer
(208) 363-3683
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