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October 2002

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Date:
Fri, 18 Oct 2002 10:24:09 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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From:
Werner Engelmaier <[log in to unmask]>
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Hi Ioan,
>Did anybody see BGA joints failing because voiding?
No, voids, unless they are very large or a near-interfacial porosity, do not
pose a reliability problem. They do reduce heat transfer and current-carrying
capability, which in most cases is not significant.

Werner Engelmaier

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