TECHNET Archives

October 2002

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Wed, 16 Oct 2002 08:44:50 -0700
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Mark Roslawski <[log in to unmask]>
Subject:
Z-axis BGA solder joint verification ?
From:
Mark Roslawski <[log in to unmask]>
X-cc:
__Mike Mangrolia <[log in to unmask]>, __Kris Vasoya <[log in to unmask]>
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_0093_01C274F0.4A4ABBE0"
Organization:
ThermalWorks
MIME-Version:
1.0
Parts/Attachments:
text/plain (1543 bytes) , text/html (3168 bytes)

ATOM RSS1 RSS2