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Tue, 15 Oct 2002 16:34:59 EDT |
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Hi Alex,
The reliability will of course depend on the details. Just treat the stackee
[new word!] as a substrate in a normal DfR procedure. Generally speaking,
because stacked components are more alike than a component and FR-4, the
reliability bottle neck is at the board level.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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