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Date: | Fri, 6 Sep 2002 09:13:46 -0500 |
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For those of us new guys who don't know what you're
talking about most of the time <grin>
Is there some underlying principle that can be stated
in a technical way, that some ratio of glass to resin
will result in a more reliable construction?
Or is it more complicated than that?
Jack (aka "the new guy")
>Date: Thu, 5 Sep 2002 14:13:30 -0500
>From: Earl Moon <[log in to unmask]>
>Subject: Re: IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes
>
>
>Going back many years, we in the MLB business had ILS problems but didn't
>call it that. We knew, that when using very resin rich materials, certain
>forces were exerted diagonally to the trace/pad to conductor interface
>casuing cracking or separation. Most of what I talk about today is
imposing
>requirements using more moderate glass styles and corresponding resin
>contents. <snip>
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