Victor
At this time the IPC spec and military specs require all holes on circuit
boards be able to meet specification requirements after Thermal Stress 2.6.8.
 There is no differentiation.

There are no pass/fail criteria for the electrical cycling tests YET.  There
is a group that are trying to determine number of cycles that will indicate
relative reliability.

Altho barrel cracking is more often detected in vias after thermal stress, I
just found inner layer separation on vias yesterday.  It all depends on the
robustness (is that a word) of the manufacturing processes.

Susan Mansilla
Technical Director
Robisan Lab

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------