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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 6 Sep 2002 08:06:17 -0400 |
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Oliver,
We switched from Oxide to Double-treat a few years ago.
a) No prep prior to lamination, except a pass through tacky rollers.
b) Our dry film lamination process is the same for D-T as it was for oxide.
c) We use an acid dip prior to Ammonium Chloride etch, to remove the double
treat.
------------------------
d) AOI of D-T cores was our biggest challenge- I believe due to stains and
limited D-T/copper contrast.
e) Handling was also an issue. The D-T finish scratches very easily, and
the scratches are visible through the board.
e) We've since added a small oxide alternative line, for material types
that aren't available in D-T.
(we're a prototype/ small production shop. Overall, the switch was very
smooth)
Good Luck,
Mark Hargreaves
-----Original Message-----
From: Oliver Yeo [SMTP:[log in to unmask]]
Sent: Friday, September 06, 2002 2:07 AM
To: [log in to unmask]
Subject: [TN] Double coated copper
Has anyone converted from conventional copper material and oxide
process to
double treated copper for their multilayer process? If you have, I
would
appreciated it if you could help me in doing a feasibility study to
eliminate our oxide line and how we may need to change or add to our
process
to suit double treated copper.
We are currently using :
a) Mechanical brushing to clean the core material (double-side
FR4) prior to
laminting the etch resist. I read that double-treated copper cannot
be
scrubbed and is prone to chemical attack.
b) We use dry film etch resist. Will D-T copper cause us to
change this
process?
c) Ammonium chloride is the etchant.
Thank you in advance for your help.
Oliver Yeo
Quality Manager
IMP Printed Circuits Pty Ltd
Tel : 61-8 8262 1444
Fax : 61-8 8262 6004
www.imppc.com.au
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