Mr. MoonMan,

   If THERMAL Stress id GOOD for determining barrel CRACKING.   How can this
be accomplish on PTH that are 100% fill from front to back?   Will we not
able to conduct this TEST any more as more and more PCB vendor used via
fill.

victor,

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Thursday, September 05, 2002 1:38 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes


I got you now Werner. I forgot to mention, as you know, the near 45 degree
stress risers/vectors affecting ILS - in conjuction with the xyz stuff and
the various laminate, core, and prepreg stuff I sent you. This is getting
more interesting all the time and CAF fits in there too.

Thanks,

Earl

Oh yes, thermal stress is good for determining barrel cracking AND
delamination per the three hole evaluation zone in 600 and 6012.

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