Hello there,

I have some input on board bow & twist value for BGAs assembly from some
kind souls. However, I was looking for more articles written on BGAs
with relationship to the followings areas :
1. board bow & twist (warpage) on BGAs assembly
2. Soldering, inspections and Thermal profiling for BGAs assemblies
3. Layout design criteria for BGAs including how the no. of layers,
routing pattern can be determined
4. Assembly processes - the considerations and constraints, etc
5. Assembly setup for BGAs assembly - equipment, tools, etc for
prototyping.

Thanks and regards
Wee Mei

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