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September 2002

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Subject:
From:
Oliver Yeo <[log in to unmask]>
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Date:
Fri, 6 Sep 2002 15:37:10 +0930
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Has anyone converted from conventional copper material and oxide process to
double treated copper for their multilayer process?  If you have, I would
appreciated it if you could help me in doing a feasibility study to
eliminate our oxide line and how we may need to change or add to our process
to suit double treated copper.

We are currently using :

a)      Mechanical brushing to clean the core material (double-side FR4) prior to
laminting the etch resist.  I read that double-treated copper cannot be
scrubbed and is prone to chemical attack.
b)      We use dry film etch resist.  Will D-T copper cause us to change this
process?
c)      Ammonium chloride is the etchant.

Thank you in advance for your help.

Oliver Yeo
Quality Manager
IMP Printed Circuits Pty Ltd
Tel : 61-8 8262 1444
Fax : 61-8 8262 6004
www.imppc.com.au

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