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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 5 Sep 2002 15:58:36 -0500 |
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Mr. Werner,
What would you recommend for THERMAL STRESS on PWB utilizing via
fill/plug technology. With the via plug molten solder will not stress the
inner layers. What a dilemma!!!!
victor,
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Thursday, September 05, 2002 1:41 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-TM-650-2.6.8, Thermal stress, Plated Through Holes
Hi Earl,
Thermal Stress is good for barrel cracking but not very good for ILS--lots
of
controversies caused the Round Robin.
Werner
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