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September 2002

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Sep 2002 08:44:30 -0500
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Mr. Tegehall,

   What vendor dye penetrant was used?

victor,

-----Original Message-----
From: Tegehall Per-Erik [mailto:[log in to unmask]]
Sent: Wednesday, September 25, 2002 2:07 AM
To: [log in to unmask]
Subject: Re: [TN] CGAs


Edwin,

I performed a study for European Space Agency last year of the reliability
of ceramic BGAs and CGAs (625 I/Os) for space applications. The components
were mounted on two different typas of PCB laminate: polyimide/glass and
Thermount (polyimide/aramid). For the BGAs mounted on polyimide/glass, the
first failures occured after about 500 cycles (-55 C to +100 C). No failure
had occurred for the CGAs after 1000 cycles although the columns were rather
deformed and the corner columns had quite large cracks. Both the BGAs and
the CGAs mounted on Thermount survived 1000 cycles. Whereas the corner balls
on the BGAs had cracks that covered about 50% of the pad area on the CGA
(evaluated using a dye penetrant) after 1000 cycles, no cracks could be
found in the columns to the CGAs nor any deformation of the columns. Thus,
the CGAs do survive considerably higher numbers of thermal cycles than BGAs
do. Unfortunatelly, the budget and time frame for the project did not allow
me to continue the test after 1000 cycles so I cannot give you a figure for
the improvement but I estimate that it is at least a factor of four.

Per-Erik Tegehall
IVF, Sweden

-----Ursprungligt meddelande-----
Från: Louis, Edwin @ CSE [mailto:[log in to unmask]]
Skickat: den 24 september 2002 15:39
Till: [log in to unmask]
Ämne: [TN] CGAs


Can anyone please give me their experiences with Column Grid Arrays? How do
you use them,do they survive thermal cycling and
how can one calculate the size solder pillar required for a given CTE
difference?

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