Tom:

Both Glynn Shaw and Earl Moon have been mentioned in answers to your
question.  ECC hired Earl as a consultant to improve our quality and
reliability.  We immediately switched our PCB house to Glynn's because our
previous house was trying to supply us HASL boards for fine pitch and BGA's.
We learned the hard and very expensive way (50% yield post assembly)!  As
discussed, I think you need to dump the HASL and move to a more reliable
finish.  It is up to you to weigh the pros and cons of Silver, ENIG, white
tin, and OSP.  I can tell you that if you use ENIG you must find a quality
house to supply these or your next Technet posting will be about BLACKPAD!
Having learned from experience I can tell you that Glynn can talk the talk
and walk the walk.  All our problems are gone and we are finally yielding
some very good high technology assemblies!!!

Best of luck to you and a thank you to them for showing me the light!

Ken Carlile, Production Manager
Efficient Channel Coding, Inc.
600 Safeguard Plaza
Suite 100
Brooklyn Heights, OH 44131-1892
U.S.A.
Phone: (216)635-1610
Fax: (216)635-1630
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tom Parkinson -
Quality System Manager - WinTronics, Inc.
Sent: Monday, September 23, 2002 3:42 PM
To: [log in to unmask]
Subject: [TN] HASL


Hello all,

Have been looking for some kind of spec for HASL thickness and
uniformity. Having problems with small to fine pitch parts where HASL is
causing problems.

Only reference I can find so far is in 2221 where it says HASL is
checked not by mechanical thickness, but by the ability to solder per
JSTD003.
003 only talks about being able to solder - not about variability of
HASL causing problems.

My SMT people are giving me a hassle about the HASL......

Any suggestions??

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