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September 2002

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Sep 2002 08:24:37 -0500
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text/plain
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text/plain (75 lines)
The average for my pot over the last 8 months is:

Tin - 63.146%
Lead - Remaining %
Sb - .00955%
Cu - .100%
Au - .00186%
Al - <.001%
Cd - <.001%
Zn - < .001%
Ni - <.001%

Gary Camac


"McCall,Doug" wrote:

> Techies,
>
> I am interested in finding out what the solder analysis figures
> should be from the sample taken from the flow solder bath sample.
>
> Percentages of the following elements would be useful: -
> Tin, lead, antimony, copper, zinc, iron, nickel, bismuth, cadmium,
> Silver, gold, arsenic, aluminium etc.
>
> We are using 63 / 37 bar solder into the machine.
>
> Also any mil-spec equivalents would be useful.
>
> Thanks in anticipation,
>
> Regards,
>
> Doug McCall
> PCB Manufacturing Engineer - Eastbourne
> BOC EDWARDS
> Marshall Road,
> Eastbourne,
> East Sussex,
> BN22 9BA UK
> Tel: +44 (0) 1323 501 147
> Fax +44 (0) 1323 509 824
> mailto [log in to unmask]
>
> BOC Edwards is a part of BOC Limited
> Registered Office: Chertsey Road, Windlesham, Surrey GU20 6HJ
> Number 337663-English Register
> Ultimate holding company: The BOC Group plc
>
> _____________________________________________________________________
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