Tore & Peter,

   I would like more HISTORY on the intermittent issue you have experience.
I have been involved on several intermittent issues.   How was this
potential
defect confirmed and/or isolated.   Are you POSITIVE the intermittent
condition
is associated with the BGA and not something else. ie BIOS.

  The intermittent statement is so vague.   What efforts have you put into
it.

victor,

-----Original Message-----
From: Tore Jakobsen [mailto:[log in to unmask]]
Sent: Friday, September 20, 2002 5:40 AM
To: [log in to unmask]
Subject: Re: [TN] BGA failure and Rework


On Tue, 17 Sep 2002 17:23:00 -0700, Peter Lee <[log in to unmask]> wrote:

>Technet,
>
>If I may continue my question on BGA rework process:
>
>Recently we have seen intermitted failures from a few BGA assemblies.
>After removing the suspicious BGA on the rework station we noticed
>dewetting on a majority number of pads of the removed BGA. The solder
>ball residues were mostly attaching to the board.
>
>Has anyone seen this before? How likely can this be caused by a
>non-optimum rework removal profile Is baking of the board normal prior
>to rework (removal/re-placement)?
>
>We are tackling this issue from the part supplier side and looking at
>performing destructive X-ray analysis. Can someone give me an idea of
>what the ball attachment process is on the BGA?
>
>Rgds,
>Peter
>
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I saw your post on the list and it resembles some problems we've had here
with BGA's. I have a question, do the dewetted pads on the components look
dark? ("Black pads")

Rgds
Tore

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