TECHNET Archives

September 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Diamond, Pat" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Sep 2002 10:45:17 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (51 lines)
Dear all,

has anyone out there had any experience with using Multicore RA10 solder
cream  - or equivalent - with HMP (296-301 deg. C) solder powder?  I am
currently carrying out some hand soldering trials on different types of
connectors with excellent results.
Does anyone know if are there any long-term quality problems using this
compound in a Hi-Rel (Aerospace)industry?

The make up of the RA10 compound is as follows:

Cream - 2-5% modified rosin, 40-45% Rosin to IPC type MR3CN or MIL-F-14256
RA
Solder - 5% Tin - 93.5% Lead - 1.5% Silver
Carrying medium - 5-10% Propan-1,2-diol


Any information would be appreciated.

Pat

****************************************************************************
***************
The information transmitted is intended only for the person or entity to
which it is addressed and may contain confidential and/or privileged
material.

Any review, retransmission, dissemination or other use of, or taking of any
action in reliance upon, this information by persons or entities other than
the intended recipient is prohibited. If you received this in error, please
contact the sender and delete the material from any computer.
****************************************************************************
***************
Pat Diamond
Senior manufacturing Engineer
Weston Aerospace                Tel:     +44 (0)1252  868194
124 Victoria Road               Fax:    +44 (0)1252 370298
Farnborough, Hampshire, GU14 7PW        Web    www.westonaero.com>
England         Email  mailto:[log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2