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September 2002

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Wed, 18 Sep 2002 14:37:16 -0400
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Hello Rob,

The nominal distance of .007 is tight.  In the case of .8mm BGA the PCB planes will have an .0275 clearance and I have drilled .012 diameter holes in the .100 thick board.  That renders .00775 PTH wall (drill wall) to edge of copper.  It doesn't get much tighter than that.  The same configuration; signal layers use a .019 diameter pad with the distance from PTH wall edge (drill) to edge of pad of .0035, with .004 trace and .004 spacing this renders .0075 PTH wall to trace edge. These are tight numbers and are BASIC; all that "slop" is the fabrication allowance.  Increase those numbers by decreasing board thickness allowing a smaller drill diameter (aspect ratio <9/1).
FR4 is the best material to achieve success.  Polyimide usually brings on need for etch back and there simply is no real estate to do that.  Thermount is wonderful material, but is best used for its propensity to have consistent lower Er and its mainstay is low XY CTE.  I do not recommend its usage for these tight configurations.  Folks used to recommend it because its very nice registration qualities, but that Kevlar may have micro ratcheting -in my opinion- and may induce the CAF condition.
If your stuck in a tuff design I would recommend:
1. lower thickness (mils count)
2. decrease trace widths (half mils count)
3. FR4 170 deg C Tg stuff
4. new drills, one up
5. have a plan "B" ie redesign
6. group crossing of fingers

Good luck,
Boston Brad yer PCB pal

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