To all,

I thought I would throw this subject out to see if any of you have had
direct experience with this issue. One of our PCB suppliers is concerned
with doing a job for us that has a trace to plated via distance of less than
.007", stating that there is an inherent probability that under duress of
soldering or when used in a Burn-In chamber for periods of time, that the
glass material would get voids, and that there is a chance of electro
migration causing inner layer shorts. There is a lot of talk about CAF, and
they are throwing around studies by Dupont and Matsushita. They are pushing
us to go with a non-glass material, such as Thermount, but due to the longer
lead time, we cannot afford the delay.

Is there really an issue here, or are we being duped into believing
something.

Thanks in advance for all of your help.

Regards,
Rob Eason
Cody Electronics, Inc.

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