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September 2002

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Subject:
From:
Mark Hargreaves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Sep 2002 08:07:20 -0400
Content-Type:
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text/plain (46 lines)
Mark,
Sorry, no answer here, just another question.  What sort of cure tests are
the TMA & DSC ?

Thanks,
Mark Hargreaves
EMDS

        -----Original Message-----
        From:   [log in to unmask] [SMTP:[log in to unmask]]
        Sent:   Wednesday, September 18, 2002 1:09 AM
        To:     [log in to unmask]
        Subject:        [TN] Poyimide cure

        Technetters:
        I'm looking for information on the best way to confirm cure on a
polyimide board.  The particular part is a sequential lamination structure.

        My questions include:
        1.  Is the best time to confirm cure of polyimide immediately after
final lamination?
        2.  Do the polymers created require a specific cure test, e.g. is
TMA best, DSC, or other method?

        Also, can overcure be a problem with Polyimide?

        And, does this material offer special challenges with respect to gel
time, resin flow, etc?

        I've already heard differences of opinions, and am looking forward
to more avenues of knowledge from Polyimide experienced folks.

        Mark Julstrom
        Multek

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