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September 2002

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Subject:
From:
Peter Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Sep 2002 17:23:00 -0700
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Technet,

If I may continue my question on BGA rework process:

Recently we have seen intermitted failures from a few BGA assemblies.
After removing the suspicious BGA on the rework station we noticed
dewetting on a majority number of pads of the removed BGA. The solder
ball residues were mostly attaching to the board.

Has anyone seen this before? How likely can this be caused by a
non-optimum rework removal profile Is baking of the board normal prior
to rework (removal/re-placement)?

We are tackling this issue from the part supplier side and looking at
performing destructive X-ray analysis. Can someone give me an idea of
what the ball attachment process is on the BGA?

Rgds,
Peter

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