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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 12 Sep 2002 08:34:30 +0800 |
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Depending on access to the repair site, mini stencils can be a royal pain,
the extra solder paste isn't necessary to place a BGA anyway, and yes,
IMHO, the risk of solder bridging is increased.
Peter
Peter Lee <[log in to unmask]> 10/09/2002 10:34 PM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to Peter Lee
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: Re: [TN] BGA rework - excessive collapsing
What would be the impact of using mini-stencil to paste the board for
BGA rework?
Would it increase the chance of bridging or minimize it through
increased clearance and solder volume?
Rgds,
Peter
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Earl Moon
Sent: Monday, September 09, 2002 4:53 PM
To: [log in to unmask]
Subject: Re: [TN] BGA rework - excessive collapsing
With respect to PCB heating, some rework stations do a pretty good job
of
preheating the board when the profile is carefully planned and used.
With
that, the board most often is not subject to warpage as you speak.
Earl
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