This sounds like it's a VERY aggressive saponifier. In this case, what
you are seeing is probably normal and is due to the formation of
micellar soaps as a result of the reaction between the basic substances
and the carboxylic acids in the flux residues. In addition, the metal
(lead, tin, copper etc.) salts formed by the reaction of the flux with
metal oxides on the components and the solder during the preheating and
soldering processes may be converted to insoluble hydroxides, which, if
finely divided (as I would expect) may be held in suspension for
considerable periods.

I would very seriously recommend you do not keep your boards in such a
solution for 25-30 minutes. This is decidely sufficient to attack your
substrate (even if it is a hybrid circuit) as well as the more
amphoteric metals on your assembly. The dullness of the solder is a
purely cosmetic defect and is normal with such cleaning conditions: in
fact, I would expect them to look almost black!!!

Brian
Piyer wrote:
> Yes, the cleaning solution has a pH of 12-14.
> Preethi
> ----- Original Message -----
> From: "Rudy Sedlak" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, September 03, 2002 12:37 PM
> Subject: Re: [TN] Milkiness in cleaning solution
>
>
>
>>Another possibility is that the milkiness may be Tin oxides which are
>>dispersed in the cleaner....this is especially probable if the cleaner has
>
> a
>
>>high pH.
>>
>>Rudy Sedlak
>>RD Chemical Company
>>
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