For Graham and Don,
Thant's an answer making sense. I've just started my cleaning/cleanliness
upgrade for the book's next release. I'm going back through my history, the
history of cleaning and how clean is clean, and all the IPC stuff that is
available. This little subject demands a huge effort. No wonder Doug has a
guaranteed lifetime salary.
Earl
----- Original Message -----
From: "Don Vischulis" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 10, 2002 8:40 AM
Subject: Re: [TN] SIR Testing issue
> Graham,
>
> I don't have a copy of GR 78, but cleaning solvents are normally not used
to
> remove flux residues from SIR patterns. The patterns are designed with
> spacing such that the "relatively benign" R or RMA flux residues on the
> termination pads will not influence the test results. I don't recall if
the
> following is in the procedure, but it is good practice to place a suitable
> shield over the SIR comb patterns to protect them from flux splatters
during
> the soldering operation. Flux particles in this area can affect the test
> results.
>
> Don Vischulis
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Graham Naisbitt
> Sent: Tuesday, September 10, 2002 7:53 AM
> To: [log in to unmask]
> Subject: [TN] SIR Testing issue
>
>
> Hello Techies
>
> I do hope you can help with this one:
>
> I have a board fabricator who is testing to GR-78-CORE Issue 1 September
> 1997.
>
> In section 14.4.3 - Terminating Test Patterns that are hand soldered using
R
> or RMA flux.
>
> It states: "do not remove flux."
>
> His questions: Why? Also, how does he do this as this (flux residues) will
> influence his test results?
>
> So, anyone care to answer....Doug, put that Mountain Dew down for just a
> moment... MoonMan, is this covered in your book....Steve, can't use your
new
> toy for this soldering job...
>
> Regards, Graham Naisbitt
> --
> [log in to unmask]
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