There is no reason for these "dents" on the balls' surfaces to cause any
voiding. Other issues are at work.
MoonMan
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 10, 2002 6:46 AM
Subject: Re: [TN] 1mm bga voiding
> Peter and Technetters,
>
> The cross section is of a part as it comes in the door. That part has not
> been attached to a board. The question is would the dents on the ball
> cause voiding when it is reflowed.
>
> I have also placed three additional x-section pictures of a "Reflowed"
> balls. However, I think the link requires one to sign in to ofoto.com
(for
> free though).
>
>
http://us.f201.mail.yahoo.com/ym/ShowLetter?YY=40492&order=down&sort=date&po
s=0&view=a&head=brief
>
> I will email the pictures directly to anyone interested (they're in jpeg
format).
>
> Thanks for all the replies
>
> Al
>
>
>
>
>
> [log in to unmask] on 09/09/2002 09:53:03 PM
>
> To: "TechNet E-Mail Forum." <[log in to unmask]>,
[log in to unmask]
> cc: [log in to unmask]
>
> Subject: Re: [TN] 1mm bga voiding
>
>
>
> Al,
>
> You have one very irregularly shaped ball there ('skews the expression).
> Can't see much of the voiding you talked about, though. I take it the bit
> at the top of the picture is the component pad (?). If you are actually
> getting a lot of voiding as well, I suspect that your thermal profile is a
> bit hot for these components, and you may have to look at shielding them a
> bit. Are these BGA's significantly smaller / less 'massive' than the other
> that you say are OK? Have you tried thermocoupling these devices
> specifically and taking their temperatures during the reflow cycle? What
> are the results? If temp is OK, how about duration?
>
> Peter
>
>
>
> [log in to unmask] 10/09/2002 01:27 AM
> Sent by: TechNet <[log in to unmask]>
>
> Please respond to "TechNet E-Mail Forum."; Please respond to alan.kreplick
>
> To: [log in to unmask]
> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
> Subject: Re: [TN] 1mm bga voiding
>
>
>
>
>
>
>
>
> Victor and other Technetters,
>
> Hopefully this link shows the 1mm BGA picture (x-section)
>
>
http://www.ofoto.com/PhotoView.jsp?UV=922011120789_31499403105&US=0&collid=2
9888403105&photoid=19888403105
>
>
>
>
> Al
>
>
>
>
> Victor Hernandez <[log in to unmask]>@IPC.ORG> on 09/09/2002
> 12:23:59 PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
> to [log in to unmask]
>
> Sent by: TechNet <[log in to unmask]>
>
>
> To: [log in to unmask]
> cc:
>
> Subject: Re: [TN] 1mm bga voiding
>
>
> Al,
>
> The IPC-A-610C sec. 12.2.12 Area Array/Ball Grid Array states that "
> Acceptable - Class 1,2,3 Less than 10% voiding in the ball to board
> interface. Process Indicator - Class 2,3 10-25% voiding in the ball to
> board interface. What is the SIZE of the ball you are using.
>
> Did we have to SIGN UP to the Web Page to view your photo. Perhaps a
> fellow TechNetter can offer their site for viewing.
>
> victor,
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Monday, September 09, 2002 9:13 AM
> To: [log in to unmask]
> Subject: [TN] 1mm bga voiding
>
>
> Technetters-
>
> We are getting 1mm BGA devices with these mechanical defects (see
attached*
> for link to picture) from testing processes at the vendor.
>
> These devices have excessive voiding when reflowed on to a board with
other
> BGAs that do not have a voiding problem. The vendor insists it is our
> process that causes the voiding.
>
> Question- would you expect this mechanical damage to lead to voiding in
> the reflowed joint?
>
>
> *
>
http://www.ofoto.com/ShareLandingSignin.jsp?UV=922011120789_31499403105&US=0
>
>
>
>
&Upost_signin=OrderPhotos.jsp%3FshowSlide%3Dtrue&Un=774560513&Um=54718403105
>
>
>
> .84079403105
>
>
>
> Al
>
> --------------------------------------------------------------------------
--
>
>
>
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
--
>
>
>
> -----
>
> --------------------------------------------------------------------------
-------
>
>
>
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
-------
>
>
>
> --------------------------------------------------------------------------
-------
>
>
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
-------
>
>
>
>
>
>
> [This e-mail is confidential and may also be privileged. If you are not
the
> intended recipient, please delete it and notify us immediately; you should
> not copy or use it for any purpose, nor disclose its contents to any other
> person. Thank you.]
>
> --------------------------------------------------------------------------
-------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-------
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
