Graham,

   Have you considered the thermal properties, TCE, of the Locite 3568
product.
Is this compatible with the TCE of the PCB and device carrier.

   What is the main PURPOSE of the proposed UNDER FILL application?
   How far into the device carrier to you HOPE to FILL?
   Will the LOCITE have to be cured?
   Is the PCB Pre Heated?


Victor,

-----Original Message-----
From: Graham Collins [mailto:[log in to unmask]]
Sent: Tuesday, September 10, 2002 6:09 AM
To: [log in to unmask]
Subject: [TN] BGA Underfill


Good day TechNet!
A question for the BGA / Underfill guru's out there (hopefully we have some
of those online).

Using a capillary flow underfill on a BGA, say a .050 pitch 26x26 array,
what is a reasonable result to expect with respect to voiding?  Should this
process result in no voids, some voids, lots of voids?   Given the size of
this part (1.38" square), is it reasonable to expect a void free underfill?

The particulars: I'm using Loctite 3568 underfill, applied using a syringe
along two edges (L pattern).  Product is on a hotplate at 100C.

Thanks all!

regards

Graham Collins
Process Engineer,
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215

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