Good day TechNet!
A question for the BGA / Underfill guru's out there (hopefully we have some of those online).

Using a capillary flow underfill on a BGA, say a .050 pitch 26x26 array, what is a reasonable result to expect with respect to voiding?  Should this process result in no voids, some voids, lots of voids?   Given the size of this part (1.38" square), is it reasonable to expect a void free underfill?

The particulars: I'm using Loctite 3568 underfill, applied using a syringe along two edges (L pattern).  Product is on a hotplate at 100C.  

Thanks all!

regards

Graham Collins
Process Engineer, 
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215

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